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Heat Transfer Enhancement of Plate Fin Heat Sinks – A Review

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Heat Transfer Enhancement of Plate Fin Heat Sinks – A Review

Prof. Pushparaj Singh | Prashant Kumar Pandey

Prof. Pushparaj Singh | Prashant Kumar Pandey "Heat Transfer Enhancement of Plate Fin Heat Sinks – A Review" Published in International Journal of Trend in Scientific Research and Development (ijtsrd), ISSN: 2456-6470, Volume-4 | Issue-6, October 2020, pp.389-394, URL: https://www.ijtsrd.com/papers/ijtsrd33374.pdf

Heat sinks have been commonly used for cool electrical, electronic and automotive parts in many industrial applications. They are effective in extracting heat at high temperatures from surfaces. The reliability of such systems depends on the temperature of their operation. Heat sinks are important components of most of these devices' thermal management systems, such as: diodes, thyristor, high power semiconductor devices such as integrated inverter circuits, audio amplifiers, microprocessors or microcontrollers. This paper highlights the use of heat sinks in electronic cooling applications, and discusses relevant literature to enhance the heat transfer efficiency of plate fin heat sinks by modifying the surface, interrupting the boundary layer and shifting the path.

Heat transfer, Heat Sinks, Plate fin heat sink, CFD, Convection, Thermal resistance, Base Temperature

Volume-4 | Issue-6, October 2020
IJTSRD | www.ijtsrd.com | E-ISSN 2456-6470
Copyright © 2019 by author(s) and International Journal of Trend in Scientific Research and Development Journal. This is an Open Access article distributed under the terms of the Creative Commons Attribution License (CC BY 4.0) (http://creativecommons.org/licenses/by/4.0)

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