Optimization of EDM Process Parameters using Response Surface Methodology for AISI D3 Steel

Mr. P. Chinna Rao; Dr. N. Mahesh Kumar

Title:
Optimization of EDM Process Parameters using Response Surface Methodology for AISI D3 Steel

Authors:
Dr. N. Mahesh Kumar | Mr. P. Chinna Rao
DOI:
https://doi.org/10.31142/ijtsrd23535

Cite This Article :

Dr. N. Mahesh Kumar | Mr. P. Chinna Rao "Optimization of EDM Process Parameters using Response Surface Methodology for AISI D3 Steel" Published in International Journal of Trend in Scientific Research and Development (ijtsrd), ISSN: 2456-6470, Volume-3 | Issue-3, April 2019, pp.1651-1656, URL: https://www.ijtsrd.com/papers/ijtsrd23535.pdf

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Abstract :
The present work demonstrates the optimization process of material removal rate (MRR) of electrical discharge machining (EDM) by RSM (Response Surface Methodology). The work piece material was EN31 tool steel. The pulse on time, pulse off time, pulse current and voltage were the control parameters of EDM. RSM method was used to design the experiment using rotatable central composite design as this is the most widely used experimental design for modeling a second–order response surface. The process has been successfully modeled using response surface methodology (RSM) and model adequacy checking is also carried out using Minitab software. The second-order response models have been validated with analysis of variance. Finally, an attempt has been made to estimate the optimum machining conditions to produce the best possible responses within the experimental constraints.

Keywords :
CNC Machining, EDM, Material Removal Rate (MRR), Response Surface Methodology

Publication Details:

Unique Identification Number : IJTSRD23535

Published In : Volume-3 | Issue-3, April 2019

Page Number(s) : 1651-1656

Publisher Name : IJTSRD | www.ijtsrd.com | E-ISSN 2456-6470

Copyright © 2019 by author(s) and International Journal of Trend in Scientific Research and Development Journal. This is an Open Access article distributed under the terms of the Creative Commons Attribution License (CC BY 4.0) (http://creativecommons.org/licenses/by/4.0)

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